Industry background and product direction: providing high-speed and high-precision inspection systems for key processes

In the manufacture of semiconductor chips, the key dimension of the node below 20nm - IC mass production lacks online wafer defect detection means.

< 32nm: Traditional optical inspection has reached its limit and it is difficult to obtain an effective detection signal.

< 28nm: Optical detection Recipe adjustment time is more than two weeks, and it is difficult to detect fatal defects.

< 10nm: Traditional optical inspection may be completely ineffective and the risk of mass production is high.

Dongfang Jingyuan’s main product direction is the integration of electron beam detection and process optimization. Its application covers key areas of semiconductor design and manufacturing, and serves the world's most advanced large-scale semiconductor chip design and manufacturing companies.

Dongfang Jingyuan’s products: development and production of electron beam image inspection equipment and integrated optimization systems for semiconductor chip processes up to 20 nanometers, providing high-speed and high-precision detection systems for key processes.

Key processes (exposure, development, etching): Determine the chip's yield and final performance, requiring sophisticated inspection and real-time monitoring.

Company advantage: mastering front-end technology